Board-form heat-insulation material
TOMBO™ No. 5625
FINEFLEX BIO™ Board
FINEFLEX BIO Board is a product that adds inorganic and organic binders to FINEFLEX BIO Bulk and is molded into a board form.
TOMBO No.5625-M is a minimal odor type that has incorporated a very small amount of organic binder. TOMBO No.5625-A is a general-use type that has excellent workability.
It is lightweight and has a low thermal conductivity, and so it displays excellent insulation performance.
Processed products can be manufactured.
Lining material and backup material for insulating the ceilings of kilns and furnace walls
Expansion allowance filler for each part within a furnace
Gas sealing materials
|Features||Minimal odor type||It offers excellent machinability.|
|Maximum heat resistant temperature (°C)||1300|
|Regular working temperature (°C)||1000|
|Bending strength (MPa)||Normal state||0.2||0.5|
|Heat shrinkage rate (%)||1000°C||1.2||0.9|
|Ignition loss (%)||0.7||4.0|
|Chemical components||SiO2, CaO+MgO, other|
*Depending on the usage environment, the product may crack and warp at a temperature of 1100°C or more.
When ordering, please inform us of your usage conditions.
|Thickness (mm)||Width × length (mm)|
|25||600 × 900|
- TOMBO is a registered trademark or trademark of NICHIAS Corporation.
- Name of products with "®" are registered trademarks of NICHIAS Corporation.
- Name of products with "™" are trademarks of NICHIAS Corporation.